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Grinding, Laser and Dicing Service

This introduces the equipment that will be used for the Grinding, Laser and Dicing Service at the STAR UNION (Suzhou Site.)It is also possible to provide these services with machines that are not shown here.

Available Equipment
  • Grinder
    DAG810, DFG850, DFG8540, DFG8560, DGP8761
  • Laser
    DFL7160
  • Dicer
    DAD3230, DAD3350, DFD651, DFD6340, DFD6361
  • Related Equipment
    Laminator, Mounter, CO2 Bubbler，Diammaflow, Microscope, UV
Products
  • Size
    8 Inch以下
  • Products
    8英寸及以下各類硅片、PCB 基板、石英、玻璃、陶瓷等產(chǎn)品。 8英寸及以下超硬特殊材料的切割能力（如碳化硅，鉭酸鋰等）。
    ≤ 8 “wafer, PCB substrates, quartz, glass, ceramics, etc.

Delivery Flow

  • 01

    客戶/思達(dá)優(yōu)
    確認(rèn)具體的規(guī)格和物料

  • 02

    客戶
    制作訂單

  • 03

    思達(dá)優(yōu)
    確認(rèn)加工程序

  • 04

    思達(dá)優(yōu)
    開始加工

  • 05

    思達(dá)優(yōu)
    檢查品質(zhì)

  • 06

    思達(dá)優(yōu)
    發(fā)貨

  • 07

    客戶
    確認(rèn)品質(zhì)

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