Hubless Blade
切割刀片
Resin Blade
樹(shù)脂刀
RESIN BOND BLADES
樹(shù)脂刀
This type of blade provides high processing quality for difficult-to-cut materials
Applications: Glass, Crystal, Quartz, LiTaO3, Various Semiconductor PKG, Ceramics, etc.
These blades employ a thermo-setting resin as the bonding material. Taking advantage of its excellent elasticity, the cutting ability of this bond has been maximized. They are suitable for processing difficult-to-cut materials such as glass and crystal materials.
Metal Blade
金屬刀
METAL BOND BLADES
金屬刀
Processing difficult to cut materials based on superior wear resistance and rigidity
Applications: Electronics components, Optical devices, Various types of semiconductor packages, Ceramics, Mono-crystal Ferrit, Glass, etc.
It was used as the bonding agent material to realize strong holding power. As a result, these blades have a low wear rate. They are excellent for accurate cutting or grooving of electronic devices such as CSP packages, ceramics, and optical materials. Also, since they have both excellent rigidity and cutting ability there is low risk of wavy cutting.
Precut / Dressing Boards
預(yù)切割板/磨刀板
Dress #320 ~ Precut #5000
DRESSING BOARD
磨刀板
保持切割品質(zhì)穩(wěn)定和維持刀片切割能力的磨刀板。 在合適的條件下磨刀，可以大限度發(fā)揮出刀片的切割性能
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